The Dimensity 1300 is built on TSMC’s 6nm process, featuring an octa-core with four ARM Cortex-A78 cores and four Cortex-A55 efficiency cores. MediaTek says the former consists of one Ultra core that runs up to 3GHz, and three Super cores that runs up to 2.6GHz. Meanwhile, the latter four cores scale up to 2GHz in processing speed. As for graphics acceleration, the chipset also includes a 9-core ARM Mali-G77 MC9 GPU. It can support displays that feature resolutions of up to 2520 x 1080 pixels and refresh rates of up to 168 Hz. Memory-wise, the Dimensity 1300 can be paired together with as much as 16GB of LPDDR4x RAM and supports UFS 3.1 storage. It also comes with the MediaTek APU 3.0 for AI-based multi-tasking, and HyperEngine 5.0 for gaming-related optimisations. In terms of imaging, the SoC supports up to 200MP cameras and comes with new AI-camera enhancements that enables for improved lowlight and HDR shots. The chipset also supports a variety of imaging modes, including 4K HDR Video with 3-Exposure Fusion, AI-Panorama Night Shot, AI Multi-Person Bokeh Video, and Multi-Depth Smart Focus Video. There’s also the onboard hardware-accelerated AV1 decoding for faster 4K streaming. MediaTek has yet to reveal which devices will launch together with the new Dimensity 1300. However, rumours suggest that OnePlus’ upcoming smartphone, which is believed to be either the Nord 2T or Nord 3, will be one of the first devices to feature the mid-range chipset. (Source: MediaTek [official website])
